|2018/06/02||Paper submission deadline is postponed to June 17, 2018 (final deadline).|
|2018/05/29||Regarding two-page submission, it should follow the template shown in the website link but just be cut down to two pages. NOTE: The two-page submission could include two-page supplements with figures and figure captions. (Please click here to see the template.)|
|2018/04/24||Online registration for TPC paper selection meeting is open. We invite all SC members, TPC members, and OC members to register and attend. Please click here for more details.|
|2018/04/02||On-line paper submission system is open. Please click following links for the submission guideline and login page. Paper submission deadline is on June 3, 2018 .|
|2018/03/20||Transportation information for TPC paper selection meeting is released. Please click here to download the PDF file.|
|2018/02/01||A-SSCC 2018 website is up.|
The IEEE A-SSCC 2018 (Asian Solid-State Circuits Conference) is an international forum for presenting the most
updated and advanced chips and circuit designs in solid-state and semiconductor fields. The conference is
supported by the IEEE Solid-State Circuits Society and will be held in Asia. Further details on the conference
and paper submission guidelines and templates will be available at the A-SSCC official website
http://www.a-sscc2018.org/) around the beginning of April 2018.
The miniaturized silicon technology enabled big success in the realization of software solutions such as machine learning, big data, virtual and augmented realty in the image and speech recognition, the medical diagnosis and the autonomous driving automobiles. The current software solutions, however, consume huge power by employing cloud computers along with many graphic processing units and a large amount of memory. Nowadays, the integrated circuit design community tries to develop efficient low-power mobile intelligence solutions by taking challenges in the design of digital and analog circuits, processor architecture, and system for compact IoT devices.
Prospective authors are invited to submit
four-page or two-page
manuscripts, including figures, tables and references, to the official A-SSCC 2018 website.
The two-page submission could include two-page supplements with figures and figure captions. All papers
will be handled and reviewed electronically. Papers are solicited in the following categories:
Papers related to integrated circuits for intelligent systems are highly solicited. Papers on low-power and/or low-voltage approaches, signal integrity, noise, test, and manufacturability for all the above categories are welcomed. Measurement results are highly recommended, especially for analog, and RF categories. Design methodologies for SiP, and SoC are included in the scope of the conference; the papers only describing CAD tools and CAD algorithms are not considered. Authors must follow detailed instructions provided within the “Authors” section of the website, including the Authors’ Guide and Pre-publication Policy. The technical content beyond the abstract of the accepted paper must not be announced, published, or in any way put in the public domain prior to the Conference. Extended versions of selected papers from the Conference will be published in a Special Issue of the IEEE Journal of Solid-State Circuits.
Following are the website links for the past conferences.